H. Lee, J. K. Park, J. T. Kim, "High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)," Advances in Electrical and Computer Engineering, vol.18, no.3, pp.9-14, 2018, doi:10.4316/AECE.2018.03002
Citation Format:
AECE
Elsevier
Harvard
IEEE
Oxford
Springer
Wiley