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Computer-Aided Design in Electromagnetics - the Case for Surface Impedance Boundary ConditionsIDA, N.   , Di RIENZO, L. , YUFEREV, S. |
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Author keywords
boundary element methods, diffusion processes, electromagnetics, numerical analysis, surface impedance boundary conditions
References keywords
impedance(23), boundary(22), surface(21), conditions(18), yuferev(13), magnetics(10), time(8), domain(8), finite(7), problems(6)
Blue keywords are present in both the references section and the paper title.
About this article
Date of Publication: 2012-08-31
Volume 12, Issue 3, Year 2012, On page(s): 3 - 12
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2012.03001
Web of Science Accession Number: 000308290500001
SCOPUS ID: 84865841813
Abstract
Surface impedance boundary conditions (SIBCs) have been successfully used for over 70 years in both analytical and numerical computation. With the need to model increasingly complex geometries and smaller artifacts, its importance in computer-aided design of electromagnetic devices has become prominent. High frequency SIBCs have been particularly successful because of the minimal penetration of electromagnetic fields in conductors and lossy dielectrics. SIBCs based on the skin depth have also been used although these have been limited to the first order (Leontovich) condition and Leontovich-like conditions. Little has been done in incorporating second order SIBCs and higher. A general method of derivation of SIBCs of arbitrary order is presented here and shown to apply to low frequency power structures including electric machines, transmission lines and nondestructive testing of materials. The proposed SIBCs are universally applicable and the order of the SIBC allows control of errors in design. Whereas low order SIBCs apply to classical flat surfaces and perpendicular diffusion, higher order conditions take into account curvatures and lateral diffusion of fields as well. Results shown include transmission line parameters, eddy current testing and other power applications in which they contribute to speed and accuracy of the design. In some cases, the use of SIBCs is not only possible but rather is critical to the very ability to obtain an acceptable design. |
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| [1] S. A. Schelkunoff, "The impedance concept and its application to problems of reflection, radiation, shielding and power absorption," Bell Systems Technical Journal, Vol. 17, pp. 17-48, 1938.
[2] M. A. Leontovich, "On the approximate boundary conditions for the electromagnetic field on the surface of well conducting bodies," in Investigations of Radio Waves, B.A. Vvedensky Ed., Moscow: Acad. of Sciences of USSR (in Russian), pp. 5-12, 1948. [3] S. Yuferev and N. Ida, "Surface Impedance Boundary Conditions: A Comprehensive Approach," Boca Raton: CRC Press, 2010. [4] P. Dular, C. Geuzaine and J. Gyselinck, "Surface impedance boundary conditions in dual time domain finite element formulations, "IEEE Transactions on Magnetics, Vol. 46 No. 8, pp. 3524-3531, 2010. [CrossRef] [SCOPUS Times Cited 11] [5] S. Cruciani, M. Feliziani and M. Okoniewski, "Efficient low order approximation for surface impedance boundary conditions in finite-difference time domain method," IEEE Transactions on Magnetics, Vol. 48, No. 2, pp. 271-274, 2012. [CrossRef] [Web of Science Times Cited 10] [SCOPUS Times Cited 11] [6] R. Sabariego, C. Geuzaine, P. Dular and J. Gyselinck, "Time-domain surface impedance boundary conditions enhanced by coarse volume finite element discretization," IEEE Transactions on Magnetics, Vol. 48, No. 2, pp. 631-634, 2012. [CrossRef] [Web of Science Times Cited 7] [SCOPUS Times Cited 8] [7] A. D. U. Jafri, Q. A. Naqvi and K. Hongo, "Scattering of electromagnetic plane wave by a circular disk with surface impedance," Progress In Electromagnetics Research, Vol. 127, pp. 501-522, 2012. [CrossRef] [Web of Science Times Cited 9] [SCOPUS Times Cited 10] [8] M. Kunze, "Surface impedances for planar conductors in volume discretization methods without frequency limitations," Microwave Conference (GeMIC), pp. 1 - 4, 2011 [9] I. V. Lindell and A. Sihvola, "Mixed-Impedance Boundary Conditions," IEEE Transactions on Antennas and Propagation, Vol. 59, No. 1, pp. 1580-1586, 2011. [CrossRef] [Web of Science Times Cited 19] [SCOPUS Times Cited 24] [10] S. Yuferev and N. Ida, "Selection of the Surface Impedance Boundary Conditions for a Given Problem," IEEE Transactions on Magnetics, Vol. 35, No. 3, pp. 1486-1489, May 1999. [CrossRef] [Web of Science Times Cited 47] [SCOPUS Times Cited 54] [11] S. Yuferev and N. Ida, "Time domain surface impedance concept for low frequency electromagnetic problems - Part I: derivation of high order surface impedance boundary conditions in the time domain," IEE Proceedings - Science, Measurement and Technology, Vol. 152, No. 4, pp. 175-185, July 2005. [CrossRef] [Web of Science Times Cited 8] [SCOPUS Times Cited 10] [12] S. Barmada, L. Di Rienzo, N. Ida, and S. Yuferev, "Time domain surface impedance concept for low frequency electromagnetic problems - Part II: application to transient skin and proximity effect problems in cylindrical conductors," IEE Proceedings - Science, Measurement and Technology, Vol. 152, No. 5, pp. 207-216, Sept. 2005. [13] S. Schmid, N. Chavannes, N, Kuster, E. Okoniewska, D. Pasalic and M. Okoniewski, "Advanced surface impedance boundary conditions in EM-FDTD," Proceedings of the 2011 IEEE International Symposium on Antennas and Propagation, pp. 2319-2311, 2011 [CrossRef] [SCOPUS Times Cited 1] [14] J. J. Akerson, M. A. Tassoudji, Y. E. Yang, J. A. Kong, "Finite difference time domain (FDTD) impedance boundary condition for thin finite conducting sheets," Progress In Electromagnetics Research, PIER 31, pp. 1-30, 2001 [15] S. M. Rytov, "Calcul du skin-effet par la methode des perturbations," Journal of Physics, 2 (3), 1940, 233-242. [16] L. Di Rienzo, S. Yuferev, and N. Ida, "Computation of the impedance matrix of multiconductor transmission lines using high order surface impedance boundary conditions," IEEE Trans. Electromagn. Compat., Vol. 50, No. 4, November 2008, pp. 974-984. [CrossRef] [Web of Science Times Cited 22] [SCOPUS Times Cited 25] [17] S. Yuferev and L. Di Rienzo, "Surface impedance boundary conditions in terms of various formalisms," IEEE Trans. Magn., Vol. 46, No. 9, September 2010, pp. 3617-3628. [CrossRef] [Web of Science Times Cited 24] [SCOPUS Times Cited 25] [18] S. Yuferev, L. Di Rienzo and N. Ida, "Surface Impedance Boundary Conditions for Finite Integration Technique," in IEEE Transactions on Magnetics, Vol. 42, No. 4, April 2006, pp. 823-826. [CrossRef] [Web of Science Times Cited 3] [SCOPUS Times Cited 4] [19] S. Yuferev, N. Farahat and N. Ida, "Use of the Perturbation Technique for Implementation of Surface Impedance Boundary Conditions for the FDTD Method," IEEE Transactions on Magnetics, Vol. 36, No. 4, July 2000, pp. 942-945. [CrossRef] [Web of Science Times Cited 4] [SCOPUS Times Cited 8] [20] S. Yuferev and N. Ida, "Efficient Implementation of the Time-Domain Surface Integral Boundary Condition for the Boundary Integral Method," IEEE Transactions on Magnetics, Vol. 34 No. 5, pp. 2763-2666, Sept. 1998. [CrossRef] [Web of Science Times Cited 6] [SCOPUS Times Cited 9] [21] S. Yuferev and N. Ida, "Impedance Boundary Conditions of High Order Approximation for Electromagnetic Transient Scattering Problems," Proceedings of the 10th International Conference on Antennas and Propagation, Edinburgh, April 12-17, 1997), IEE Publication No. 426, pp.1,306-1,309, 1997. [CrossRef] [22] M. Cao and P. P. Biringer, "BIE formulation for skin and proximity effect problems of parallel conductors," IEEE Trans. Magn., Vol. 26, No. 5, pp. 2768-2770, Sept. 1990. [CrossRef] [Web of Science Times Cited 22] [SCOPUS Times Cited 21] [23] C. A. Brebbia, The Boundary Element Method for Engineers. London: Pentech Press, 1980. [24] S. Yuferev and N. Ida, "Selection of the Surface Impedance Boundary Conditions for a Given Problem," IEEE Transactions on Magnetics, Vol. 35, No. 3, pp. 1486-1489, May 1999. [CrossRef] [Web of Science Times Cited 47] [SCOPUS Times Cited 54] [25] N. Farahat, S. Yuferev and N. Ida, "High order surface impedance boundary conditions for the FDTD method," IEEE Transactions on Magnetics, Vol. 37, No. 5, September 2001, pp. 3242-3245. [CrossRef] [Web of Science Times Cited 13] [SCOPUS Times Cited 17] [26] S. Yuferev L. Proekt and N. Ida, "Surface impedance boundary conditions near corners and edges: rigorous consideration," in IEEE Transactions on Magnetics, Vol. 37 No. 5, Sep 2001, pp. 3465-3468. [CrossRef] [Web of Science Times Cited 12] [SCOPUS Times Cited 14] [27] O. Moreau, V. Costan, J.-M. Devinck, and N. Ida, "Finite Element Modeling of Support Plate Clogging-up in Nuclear Plant Steam Generator," Proceedings of the 8th International Conference on NDE in Relation to Structural Integrity for Nuclear and Pressurised Components, 29 September to 1 October 2010, Berlin, Germany (PDF only). [28] Y. Le Menach, "Contribution a la modelisation numerique tridimensionnelle des systemes electrotechniques," Ph.D. dissertation, Universite de Lille 1, 1999. [29] N. Ida, Y. Lemenach, and T. Henneron, "High Order Surface Impedance Boundary Conditions with the A-Ø Formulation," Facta Universitatis: Electronics and Energetics, vol. 24, No. 2, August 2011, pp. 147-155. Web of Science® Citations for all references: 253 TCR SCOPUS® Citations for all references: 306 TCR Web of Science® Average Citations per reference: 8 ACR SCOPUS® Average Citations per reference: 10 ACR TCR = Total Citations for References / ACR = Average Citations per Reference We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more Citations for references updated on 2024-11-22 00:38 in 126 seconds. Note1: Web of Science® is a registered trademark of Clarivate Analytics. Note2: SCOPUS® is a registered trademark of Elsevier B.V. Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). 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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.
