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High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)LEE, H.   , PARK, J. K. , KIM, J. T. |
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Author keywords
integrated circuit reliability, SPICE, crosstalk, interconnect, through-silicon via
References keywords
design(13), systems(7), silicon(6), integration(6), integrated(6), circuits(6), chip(6), vias(5), technology(5), modeling(5)
Blue keywords are present in both the references section and the paper title.
About this article
Date of Publication: 2018-08-31
Volume 18, Issue 3, Year 2018, On page(s): 9 - 14
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2018.03002
Web of Science Accession Number: 000442420900002
SCOPUS ID: 85052155428
Abstract
This paper proposes a regression noise model that can cover the noise effect from N-coupled TSVs based on SPICE simulation and reliability analysis flow for high-level simulation using a regression model. Regression analysis is adopted to develop a simple noise model with a single parameter and use the superposition theorem to extend the number of TSV lines that produce the noise. The proposed regression model has over 99 percent accuracy with SPICE in the given parameter range. For the N-coupled TSV wire, the regression noise model has over 96 percent accuracy. This paper choose the transaction level simulation for the high-level proposed analysis flow to calculate the single bit error rate of over 100 billion transaction data in a few minutes. Our simulation result shows the effect of the N-coupled TSV crosstalk glitch noise on the single bit error rate when the probability function type of the manufacturing noise is considered. |
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[CrossRef] [SCOPUS Times Cited 2] Web of Science® Citations for all references: 2,458 TCR SCOPUS® Citations for all references: 3,546 TCR Web of Science® Average Citations per reference: 98 ACR SCOPUS® Average Citations per reference: 142 ACR TCR = Total Citations for References / ACR = Average Citations per Reference We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more Citations for references updated on 2025-06-01 11:42 in 160 seconds. Note1: Web of Science® is a registered trademark of Clarivate Analytics. Note2: SCOPUS® is a registered trademark of Elsevier B.V. Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site. |
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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.