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Thermal Aspects Related to Power AssembliesPLESCA, A.   , SCINTEE, A. |
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Author keywords
heating, modeling, power assembly, simulation software, temperature
References keywords
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
Blue keywords are present in both the references section and the paper title.
About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568
Abstract
In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions. |
| References | | | Cited By «-- Click to see who has cited this paper |
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Stefan cel Mare University of Suceava, Romania
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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.
