|1/2017 - 10|
Design Options for Thermal Shutdown Circuitry with Hysteresis Width Independent on the Activation TemperaturePLESA, C.-S. , NEAG, M. , RADOIAS, L.
|View the paper record and citations in|
|Click to see author's profile in SCOPUS, IEEE Xplore, Web of Science|
|Download PDF (1,369 KB) | Citation | Downloads: 1,644 | Views: 2,268|
bipolar integrated circuits, hysteresis, integrated circuit reliability, power system protection, thermal analysis
thermal(7), circuit(6), protection(5), voltage(4), test(4), power(4), current(4)
Blue keywords are present in both the references section and the paper title.
About this article
Date of Publication: 2017-02-28
Volume 17, Issue 1, Year 2017, On page(s): 69 - 74
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2017.01010
Web of Science Accession Number: 000396335900010
SCOPUS ID: 85014193533
This paper presents several design options for implementing a thermal shutdown circuit with hysteretic characteristic, which has two special features: a programmable activation temperature (the upper trip point of the characteristic) and a hysteresis width largely insensitive to the actual value of the activation temperature and to variations of the supply voltage. A fairly straightforward architecture is employed, with the hysteresis implemented by a current source enabled by the output of the circuit. Four possible designs are considered for this current source: VBE/R, modified-VBE/R, Widlar and a peaking current source tailored for this circuit. First, a detailed analytical analysis of the circuit implemented with these current sources is performed; it indicates the one best suited for this application and provides key sizing equations. Next, the chosen current source is employed to design the thermal shutdown protection of an integrated Low-Dropout Voltage Regulator (LDO) for automotive applications. Simulation results and measurements performed on the silicon implementation fully validate the design. Moreover, they compare favorably with the performance of similar circuits reported recently.
|References|||||Cited By «-- Click to see who has cited this paper|
| Thermal Considerations for Linear Regulators, Application Note ANP2, Sipex Co., Milpitas, 2006, pp. 1-8
 G. A. Rincon-Mora, "Analog IC Design with Low-Dropout Voltage Regulators", pp. 347-373, McGraw-Hill Professional, 2009
 Y. C. Hung, D. J. Ceng, "A Sub-1V CMOS LDO regulator with multiple protection capabilities", Computer, Consumer and Control (IS3C), 2014, pp. 800-803,
[CrossRef] [Web of Science Times Cited 1] [SCOPUS Times Cited 1]
 A.-G. Bajenaru, C. Boianceanu, G. Brezeanu, Investigation of electro-thermal behaviour of a linear voltage regulator and its protection circuits by simulator coupling", International Semiconductor Conf., 2013, pp. 237-240,
[CrossRef] [SCOPUS Times Cited 7]
 J. Altet, R. Antonio, "Thermal testing of integrated circuits", pp. 53-96, Kluwer Academic Publisher, 2002
 Plesca A, Scintee A, "Thermal aspects related to power assemblies", Advances in Electrical and Computer Engineering, vol. 10, 2010, pp. 23-27,
[CrossRef] [Full Text] [Web of Science Times Cited 5] [SCOPUS Times Cited 5]
 Zhang B, Feng Q.Y. "A novel thermal-shutdown protection circuit", 3rd International Conference on Anti-Counterfeiting, Security and Identification in Communication (ASID), 2009, pp. 535-538,
[CrossRef] [Web of Science Times Cited 4]
 Nagel, M.H., Fonderie, "Integrated 1V thermal shutdown circuit", Electronics Letters, 1992, vol. 28, pp 969-970,
[CrossRef] [SCOPUS Times Cited 6]
 Tan C., Liu Z., "A bandgap reference and over temperature protection circuit designed for TCXO chip", International Conference on Intelligent Transportation, Big Data & Smart City, 2015, pp. 8-11,
[CrossRef] [Web of Science Times Cited 2] [SCOPUS Times Cited 2]
 Tan C., Chen W.,"Design of a Over-Temperature Protection Circuit for Power Management Chip", Journal of Hunan University of Technology, 2009-05
 Wu J., Zou X.C.,"An Improved Thermal-Shutdown Circuit with High Precision and Low Power Consumption", Microelectronics & Computer, 2009-02
 A. Dutta, S. Alampally, "DFT Implementations for Striking the Right Balance between Test Cost and Test Quality for Automotive SOCs", IEEE International Test Conference, 2008, pp. 1-10,
 B. Peng, I-Y Chen, "IC HTOL Stress Condition Optimization", Defect and Fault Tolerance in VLSI Systems, 19th IEEE International Symposium, 2004, pp 272-279,
[CrossRef] [Web of Science Times Cited 5] [SCOPUS Times Cited 8]
 Uprating Semiconductors for High-Temperature Applications, TN-00-18, Micron Tehnology Inc., Idaho, 2004, pp. 1-14
 P. Brokaw, J. Audy, "Low voltage current mirror and CTAT current source and method ", US5982201 A, 1998
 Kerns, D.V., Jr., "Optimization of the peaking current source", Solid-State Circuits, IEEE Journal, 1986, vol. 21, pp. 587-590,
[CrossRef] [Web of Science Times Cited 14] [SCOPUS Times Cited 18]
 Cheng, M.-H., Wu, Z. -W, "Low-power low-voltage reference using peaking current mirror circuit", Electronics Letters, IET, 2015, vol. 41, pp. 572-573,
[CrossRef] [Web of Science Times Cited 30] [SCOPUS Times Cited 44]
Web of Science® Citations for all references: 61 TCR
SCOPUS® Citations for all references: 91 TCR
Web of Science® Average Citations per reference: 3 ACR
SCOPUS® Average Citations per reference: 5 ACR
TCR = Total Citations for References / ACR = Average Citations per Reference
We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more
Citations for references updated on 2021-11-25 09:52 in 74 seconds.
Note1: Web of Science® is a registered trademark of Clarivate Analytics.
Note2: SCOPUS® is a registered trademark of Elsevier B.V.
Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site.
Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.